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Rigid PCB + HDI |
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| Item |
Capability |
| Min~ Max Layer Count |
1 ~ 16 layers |
| Max Board Thickness |
3.2mm |
| Min Board Thickness |
0.2mm |
| Min Hole Diameter |
6mils |
| Min Trace Width ( Inner ) |
3.5mils / 0.08mm |
| Min Trace Spacing ( Inner ) |
4mils / 0.1mm |
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| HDI PCB |
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| Item |
Capability |
| Min Buried Via |
4mils (Laser drilled) |
| Min Blind Via |
4mils (laser drilled) |
| Min Trace Width |
3.5mils/0.08mm |
| Min Air Gap |
3.5mils/0.08mm |
| Min Thin Core thickness |
12mils |
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Flexible PCB |
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| Item |
Capability |
| Min~Max Layer Count |
1~4 Layers |
| Finished board thickness |
0.075mm~3.00mm |
| Finished thickness Tolerance |
+/-0.02mm |
| Max board size |
780*250mm |
| Min Trace Width |
3mils(0.075mm) |
| Min Trace Gap |
3mils(0.075mm) |
| Material type |
PI, PET, PEN |
| Copper thickness |
12um, 18um, 35um, 70um |
| Surface finishing |
Entek, Electrolytic gold |
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Immersion gold |
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Electrolytic Tin |
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Immersion silver |
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Capability