#
Lead Free (Immersion Silver / OSP / Immersion Gold / Electrolytic Gold / Lead Free HAL) PCB & Halogan Free PCB

Since the early 90's of the 20 century, Hoiho has started study Lead Free PCB fabrication.
We made the first lead-free board in electrolytic gold process.

In 1999 ,Hoiho succedded in setting up an OSP ( Entek ) and Immersion Gold line.

In 2004, protyotype of both immersion silver and lead-free HAL passed the qualification. The production ramped up to high volume thereafter.

In 2007, Immersion Tin line installed.

Product of Halogan Free PCB started in 2002.

LEADFREE PCB
Development
Roadmap
Other Attributes
Laminate
 
 © Copyright Hoiho PCB. All Rights Reserved.