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| Lead Free Technology Roadmap, Year 2012 / 2013 / 2014 |
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|
2012 |
2013 |
2014 |
| Max panel Size |
23.5" x 20" |
23.5" x 20" |
24" x 22.5" |
|
Layer |
1~12 |
1~16 |
1~16 |
|
Hole Diameter |
0.15mm |
0.15mm |
0.15mm |
|
Line Width/Space |
3.5mil / 4mil |
3.5mil / 3.5mil |
3mil / 3mil |
|
Surface Finishing |
Electrolytic Gold |
Electrolytic Gold |
Electrolytic Gold |
| Entek |
Entek |
Entek |
|
Immersion Gold |
Immersion Gold |
Immersion Gold |
| Immersion Silver |
Immersion Silver |
Immersion Silver |
|
Lead Free HAL |
Lead Free HAL |
Lead Free HAL |
|
Green Laminate |
Mass Production |
Mass Production |
Mass Production |
|
Inner Layer Base Copper |
3 oz |
3 oz |
4 oz |
|
Outer Layer Copper |
3 oz |
4 oz |
4 oz |
|
LaminateTg |
135; 150; 170ˇăC;
180; 280 |
135; 150; 170ˇăC;
180; 280 |
135; 150; 170ˇăC;
180; 280 |
|
Aspect Ratio |
10:1 |
12:1 |
12:1 |
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Roadmap