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| Lead Free Technology Roadmap, Year 2007 / 2008 / 2009 |
|
|
2007 |
2008 |
2009 |
| Max panel Size |
23.5" x 20" |
23.5" x 20" |
24" x 22.5" |
|
Layer |
1~16 |
1~16 |
1~16 |
|
Hole Diameter |
0.25mm |
0.20mm |
0.2mm |
|
Line Width/Space |
4mil / 4mil |
4mil / 4mil |
3mil / 3mil |
|
Surface Finishing |
Electrolytic Gold |
Electrolytic Gold |
Electrolytic Gold |
| Entek |
Entek |
Entek |
|
Immersion Gold |
Immersion Gold |
Immersion Gold |
| Immersion Silver |
Immersion Silver |
Immersion Silver |
| Immersion Tin |
Immersion Tin |
Immersion Tin |
|
Lead Free HAL |
Lead Free HAL |
Lead Free HAL |
|
Green Laminate |
Mass Production |
Mass Production |
Mass Production |
|
Inner Layer Base Copper |
3 oz |
3 oz |
4 oz |
|
Outer Layer Copper |
3 oz |
4 oz |
4 oz |
|
LaminateTg |
135; 150; 170ˇăC;
180; 280 |
135; 150; 170ˇăC;
180; 280 |
135; 150; 170ˇăC;
180; 280 |
|
Aspect Ratio |
8:1 |
10:1 |
10:1 |
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Roadmap