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| Other Attributes on Lead Free PCB |
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| Attribute |
Immersion Silver |
ENIG |
OSP |
Electrolytic Gold |
Lead Free HAL |
Immersion Tin |
| Shelf Life (months) |
3 |
12 |
6 |
12 |
12 |
3 |
| Multiple Reflow |
3 |
3+ |
4+ |
4 |
4 |
3 |
| Process Temp. |
50¡ãC |
80¡ãC |
40¡ãC |
70¡ãC |
260¡ãC |
50¡ãC |
| Thickness |
0.2 ¦Ìm |
0.03 ¦Ìm |
0.2 ¦Ìm |
0.03 ¦Ìm |
5-12 ¦Ìm |
0.8 ¦Ìm |
| Hold Time Constraints |
Growth of inter-metallic |
Oxidation of Ni |
Oxidation of Ni |
Oxidation of Ni |
N/A |
Tin Whisker |
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Other Attributes